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The Process Engineering team provides value add by:

Wafer Probing Process Optimization:

• Develop and refine wafer probing processes for testing semiconductor devices at the wafer level.
• Optimize the probe process parameters (e.g., contact force, probing speed, alignment accuracy) to improve yield, accuracy, and throughput.
• Work with design and test engineers to establish probing specifications and testing procedures.

·  Probe Card and Equipment Management:

• Manage the selection, calibration, and maintenance of probe cards and wafer test equipment (e.g., automatic test equipment - ATE).
• Troubleshoot issues with probing equipment and implement corrective actions as needed.
• Work closely with vendors to evaluate and source new probe cards or equipment upgrades.

·  Test Data Analysis and Yield Improvement:

• Analyze wafer-level test data to identify yield and performance issues and recommend solutions.
• Work with cross-functional teams (e.g., failure analysis, design engineering) to identify and resolve root causes of testing issues.
• Monitor and improve yield performance by continuously refining test parameters and probe processes.

·  Quality Assurance and Compliance:

• Ensure that wafer probing processes comply with industry standards, customer requirements, and safety regulations.
• Conduct regular audits of the wafer probing process and implement corrective actions when deviations occur.
• Work with the quality assurance (QA) team to resolve any quality control issues related to wafer-level testing.

·  Troubleshooting and Process Failure Resolution:

• Investigate and resolve probing-related issues such as probe-to-pad misalignment, contact failures, and equipment malfunctions.
• Collaborate with process engineers to identify process-related issues and develop corrective actions.
• Perform root cause analysis (RCA) and failure mode effect analysis (FMEA) to continuously improve testing and probing techniques.

·  Collaboration and Communication:

• Collaborate with design, process, and test engineering teams to address issues related to wafer testing and improve overall product quality.
• Communicate testing results, findings, and improvement strategies to management and relevant teams.
• Work with production teams to optimize test flow, reduce cycle times, and enhance throughput.

·  Continuous Improvement:

• Participate in continuous improvement programs to enhance the efficiency, accuracy, and scalability of the wafer probing process.
• Stay updated on new technologies, tools, and best practices in wafer testing, probe card development, and semiconductor manufacturing.

·  Documentation and Reporting:

• Maintain accurate records of test procedures, process modifications, and results.
• Generate regular reports on probe yield, failure analysis, and any corrective actions taken.
• Ensure that all process documentation is current and accessible to relevant stakeholders.