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Chief Engineer II, RD

Kaohsiung Mosfets, TW, Taiwan | R&D

Job Description

- Responsible for Solder printing / Die attach / Clip bond / Reflow / Flux clean / Die Top Printing

process development, which included new machine, material evaluation and process

characterization.

- Yield and failure rate improvement by 8D approach

- To conduct the proper training to technician for new process /machine introduction

- To establish risk assessment document (like DFEMA/PFMEA) , mitigation DoE plan and quality

control document to support new package platform development and release.

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