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Process Engineer 1

日期: 2021-4-28

所在地: 上海, 31, CN

公司名: Vishay Intertechnology Inc

Job responsibilities:

1 Product development on die bonding, clip bonding and soldering process of SMF line; New machine/tooling/material evaluation and buy off.

2 Process document written and update, control plan/FMEA/Work Instruction/OCAP etc.; Yield analysis and improvement; In line process control, low yield analysis and disposition, to find out cost saving project.

3 In line subordinate personnel management and job assignment; Lead the development and implementation of Engineer Team Work plans per project requirements.

4 Customer complaint participation, root cause dig out, corrective action issue, verification and follow up.

 

Job requirements:

1 3-5 years bonding and soldering process related experience in semiconductor industry, BS/MS of Physics or Chemical are preferred.

2 Familiar with FMEA, SPC, MSA and QC 7 tools.

3 Good communication skills, fluent in written and spoken English.